Opportunities in the bonding Film market have evolved through a number of stages i.e. Lucintel has found the future of this market to be promising; the bonding film market is expected to reach $1.6 billion by 2027 with a CAGR of 6%. In this market, thermally cured is expected to remain the largest material technology, and electrical & electronics segment is expected to remain the largest application. Players can benefit from the available opportunities like increasing demand for bonding films from various end use industries, such as electrical & electronics and transportation..
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Arkema, Cytec Solvay Group, Dai Nippon Printing, DuPont, Fastel Adhesives and Substrate Products, Formplast, Gurit, H.B. Fuller, Henkel AG, Hexcel Corporation are some of the companies profiled in this report.
Some of the features of this report:
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Brandon FitzgeraldLucintel Dallas, Texas, USA Email: [email protected] Tel. 972.636.5056 Cell: 303.775.0751
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